NxEdge’s final clean capabilities reduce particulation, contamination, and trace metals on critical semiconductor equipment components — allowing for better part performance during chamber use.
We offer a proprietary cleaning process that preserves coating integrity while covering an extensive set of products and surfaces with approvals across several OEM and IDM vendors.
For both new and refurbished parts, NxEdge final clean minimizes post-PM tool recovery time, ultimately extending the life of critical parts.
Capabilities at Boise
Results in less than 100,000 particles of 0.2 micrometers size (or greater) per CM-squared
Harmless to anodized, plated, and bare aluminum surfaces
Substrates cleaned: Aluminum (anodized and bare), Nickel, Stainless Steel, Yttria, Alumina, Quartz, Titanium
Supported by a clean room and metrology lab, including liquid particle counters, QIII surface particle counters, and ICPMS (in development)
Refurbishment and re-surfacing capabilities
Class 100 Clean Room